
SPECTRUM INTEGRATED TECHNOLOGIES





SPECTRUM Capabilities
The specifications listed below represent the standard capabilities of Spectrum.
|
Items |
Capabilities |
|
Max Layer Count |
30 |
|
Max Board Thickness |
0.157 "/4.0mm |
|
Min Board Thickness (2L) |
0.024"/0.6mm |
|
Line Width and Spacing |
0.004"/0.1mm |
|
Min Drill Size |
0.010"/0.25mm |
|
Min Test Pad width and pitch |
0.002"/0.05mm Pad width |
|
|
0.004"/0.1mm Pad Pith |
|
Hole to Hole Pitch |
0.025"/0.65mm |
|
Aspect Ratio |
11 |
|
Cu Weight |
|
|
Inner Layer |
2oz |
|
Outer Layer |
3 oz |
|
Board Finishing |
|
|
HASL |
√ |
|
Lead Free HASL |
√ |
|
OSP |
√ |
|
Electroless Ni Immersion Gold (ENIG) |
√ |
|
Electrolytic Hard gold |
√ |
|
Carbon Ink |
√ |
|
Max Board Size |
24" x 27"/610mmx685mm |
|
|
(MCC and Mazali ovens) |
|
Material |
|
|
FR4 (Tg 135 to 210 °C) |
√ |
|
Halogen-Free FR4 |
√ |
|
BT Resin |
√ |
|
Polyimides |
√ |
|
NELCO N4000 series |
√ |
|
Roger R04350 |
√ |
|
Hybrid (Mix Core) |
√ |
**Also will produced based on any special requirements / materials.