SPECTRUM Capabilities



The specifications listed below represent the standard capabilities of Spectrum.

Items

Capabilities

Max Layer Count                                                

30

Max Board Thickness

0.157 "/4.0mm

Min Board Thickness (2L)

0.024"/0.6mm

Line Width and Spacing

0.004"/0.1mm

Min Drill Size

0.010"/0.25mm

Min Test Pad width and pitch

0.002"/0.05mm Pad width

 

0.004"/0.1mm Pad Pith

Hole to Hole Pitch

0.025"/0.65mm

Aspect Ratio

11

Cu Weight

 

   Inner Layer

2oz

   Outer Layer

3 oz

 Board Finishing

 

   HASL

   Lead Free HASL

   OSP

   Electroless Ni Immersion Gold (ENIG)

   Electrolytic Hard gold

   Carbon Ink

Max Board Size

24" x 27"/610mmx685mm

 

(MCC and Mazali ovens)

Material

 

    FR4 (Tg 135 to 210 °C) 

    Halogen-Free FR4

    BT Resin

    Polyimides

    NELCO N4000 series

    Roger R04350

    Hybrid (Mix Core)

 

**Also will produced based on any special requirements / materials.